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  DS310 (v2.1) november 6, 2008 www.xilinx.com 1 product specification ? 2004?2008 xilinx, inc. all xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm . all other trademarks and registered trademarks are the property of their respective owners. all specifications are subject to c hange without notice. features ? optimized for 1.8v systems - as fast as 3.8 ns pin-to-pin logic delays - as low as 12 a quiescent current ? industry?s best 0.18 micron cmos cpld - optimized architecture fo r effective logic synthesis - multi-voltage i/o operation: 1.5v through 3.3v ? available in multiple package options - 32-land qfn with 21 user i/os - 44-pin vqfp with 33 user i/os - 56-ball cp bga with 33 user i/os - pb-free available for all packages ? advanced system features - fastest in system programming 1.8v isp using ieee 1532 (jtag) interface - ieee1149.1 jtag boundary scan test - optional schmitt-trigger input (per pin) - two separate i/o banks - realdigital 100% cmos product term generation - flexible clocking modes - optional dualedge triggered registers - global signal options with macrocell control multiple global clocks with phase selection per macrocell multiple global output enables global set/reset - efficient control term clocks, output enables and set/resets for each macroc ell and shared across function blocks - advanced design security - open-drain output option for wired-or and led drive - optional configurable grounds on unused i/os - optional bus-hold, 3-state, or weak pullup on selected i/o pins - mixed i/o voltages compatible with 1.5v, 1.8v, 2.5v, and 3.3v logic levels - pla architecture superior pinout retention 100% product term routability across function block - hot pluggable refer to the coolrunner?-ii family data sheet for the archi- tecture description. description the coolrunner?-ii 32-macrocell device is designed for both high performance and low power applications. this lends power savings to high-end communication equipment and high speed to battery operated devices. due to the low power stand-by and dynamic operation, overall system reli- ability is improved. this device consists of two function blocks interconnected by a low power advanced interconnect matrix (aim). the aim feeds 40 true and complement inputs to each function block. the function blocks consist of a 40 by 56 p-term pla and 16 macrocells which contain numerous configura- tion bits that allow for combinational or registered modes of operation. additionally, these registers can be globally reset or preset and configured as a d or t flip-flop or as a d latch. there are also multiple clock signals, both global and local product term types, configured on a per macrocell basis. output pin configurations include slew rate limit, bus hold, pull-up, open drain, and programmable grounds. a schmitt trigger input is available on a per input pin basis. in addition to stor- ing macrocell output states, the macrocell registers can be configured as "direct input" registers to store signals directly from input pins. clocking is available on a global or function block basis. three global clocks are available for all function blocks as a synchronous clock source. macrocell registers can be indi- vidually configured to power up to the zero or one state. a global set/reset cont rol line is also available to asynchro- nously set or reset selected registers during operation. additional local clock, synchronous clock-enable, asynchro- nous set/reset, and output enable signals can be formed using product terms on a per-macrocell or per-function block basis. the coolrunner-ii 32-macroce ll cpld is i/o compatible with standard lvttl and lvcmos18, lvcmos25, and lvcmos33 (see ta b l e 1 ). this device is also 1.5v i/o com- patible with the use of schmitt-trigger inputs. another feature that eases voltage translation is i/o bank- ing. two i/o banks are available on the coolrunner-ii 32a macrocell device that permit easy interfacing to 3.3v, 2.5v, 1.8v, and 1.5v devices. 0 xc2c32a coolrunner-ii cpld DS310 (v2.1) november 6, 2008 00 product specification r
xc2c32a coolrunner-ii cpld 2 www.xilinx.com DS310 (v2.1) november 6, 2008 product specification r realdigital design technology xilinx? coolrunner-ii cplds are fabricated on a 0.18 micron process technology which is derived from lead- ing edge fpga product development. coolrunner-ii cplds employ realdigital, a design techniq ue that makes use of cmos technology in both the fabrication and design methodology. realdigital design technology employs a cas- cade of cmos gates to implement sum of products instead of traditional sense amplifier methodology. due to this tech- nology, xilinx coolrunner-ii cplds achieve both high per- formance and low power operation. supported i/o standards the coolrunner-ii cpld 32 macrocell features both lvcmos and lvttl i/o implementations. see ta b l e 1 for i/o standard voltages. the lvttl i/o standard is a general purpose eia/jedec standard for 3.3v applications that use an lvttl input buffer and push-pull output buffer. the lvcmos standard is used in 3.3v, 2.5v, and 1.8v applica- tions. coolrunner-ii cplds are also 1.5v i/o compatible with the use of schmitt-trigger inputs. ta b l e 1 : i/o standards for xc2c32a iostandard attribute output v ccio input v ccio input v ref board termination voltage v t lvttl 3.3 3.3 n/a n/a lvcmos33 3.3 3.3 n/a n/a lvcmos25 2.5 2.5 n/a n/a lvcmos18 1.8 1.8 n/a n/a lv c m o s 1 5 (1) 1.5 1.5 n/a n/a 1. lvcmos15 requires schmitt-trigger inputs. figure 1: i cc vs. frequency ta bl e 2 : i cc vs. frequency (lvcmos 1.8v t a = 25c) (1) frequency (mhz) 0 25 50 75 100 150 175 200 225 250 300 typical i cc (ma) 0.016 0.87 1.75 2.61 3.44 5.16 5.99 6.81 7.63 8.36 9.93 notes: 1. 16-bit up/down, resettable binary coun ter (one counter per function block). frequency (mhz) ds091_01_030105 i cc (ma) 0 0 5 10 15 20 300 250 200 150 100 50
xc2c32a coolrunner-ii cpld DS310 (v2.1) november 6, 2008 www.xilinx.com 3 product specification r recommended operating conditions dc electrical characteristics over recommended operating conditions absolute maximum ratings symbol description value units v cc supply voltage relative to ground ?0.5 to 2.0 v v ccio supply voltage for output drivers ?0.5 to 4.0 v v jtag (2) jtag input voltage limits ?0.5 to 4.0 v v ccaux jtag input supply voltage ?0.5 to 4.0 v v in (1) input voltage relative to ground ?0.5 to 4.0 v v ts (1) voltage applied to 3-state output ?0.5 to 4.0 v t stg (3) storage temperature (ambient) ?65 to +150 c t j junction temperature +150 c notes: 1. maximum dc undershoot below gnd must be li mited to either 0.5v or 10 ma, whichever is easiest to achieve. during transitions, the device pins might undershoot to ?2.0v or overshoot to +4.5 v, provided this overshoot or undershoot lasts less than 10 ns and with the forcing current being limited to 200 ma. 2. valid over commercial temperature range. 3. for soldering guidelines and thermal considerations, see the device packaging information on the xilinx website. for pb free packages, see xapp427 . symbol parameter min max units v cc supply voltage for internal logic and input buffers commercial t a = 0c to +70c 1.7 1.9 v industrial t a = ?40c to +85c 1.7 1.9 v v ccio supply voltage for output drivers @ 3.3v operation 3.0 3.6 v supply voltage for output drivers @ 2.5v operation 2.3 2.7 v supply voltage for output drivers @ 1.8v operation 1.7 1.9 v supply voltage for output drivers @ 1.5v operation 1.4 1.6 v v ccaux jtag programming pins 1.7 3.6 v symbol parameter test conditions typical max. units i ccsb standby current commercial v cc = 1.9v, v ccio = 3.6v 22 90 a i ccsb standby current industrial v cc = 1.9v, v ccio = 3.6v 38 150 a i cc (1) dynamic current f = 1 mhz - 0.25 ma f = 50 mhz - 2.5 ma c jtag jtag input capacitance f = 1 mhz - 10 pf c clk global clock input capacitance f = 1 mhz - 12 pf c io i/o capacitance f = 1 mhz - 10 pf i il (2) input leakage current v in = 0v or v ccio to 3.9v - +/-1 a i ih (2) i/o high-z leakage v in = 0v or v ccio to 3.9v - +/-1 a notes: 1. 16-bit up/down resettable binary count er (one per function block) tested at v cc = v ccio = 1.9v. 2. see quality and reliability section of the coolrunner-ii family data sheet.
xc2c32a coolrunner-ii cpld 4 www.xilinx.com DS310 (v2.1) november 6, 2008 product specification r lvcmos 3.3v and lvttl 3.3v dc voltage specifications lvcmos 2.5v dc voltage specifications lvcmos 1.8v dc voltage specifications lv c m o s 1.5v dc voltage specifications symbol parameter test conditions min. max. units v ccio input source voltage 3.0 3.6 v v ih high level input voltage 2 3.9 v v il low level input voltage ?0.3 0.8 v v oh high level output voltage i oh = ?8 ma, v ccio = 3v v ccio ? 0.4v - v i oh = ?0.1 ma, v ccio = 3v v ccio ? 0.2v - v v ol low level output voltage i ol = 8 ma, v ccio = 3v - 0.4 v i ol = 0.1 ma, v ccio = 3v - 0.2 v symbol parameter test conditions min. max. units v ccio input source voltage 2.3 2.7 v v ih high level input voltage 1.7 v ccio + 0.3 (1) v v il low level input voltage ?0.3 0.7 v v oh high level output voltage i oh = ?8 ma, v ccio = 2.3v v ccio ? 0.4v - v i oh = ?0.1 ma, v ccio = 2.3v v ccio ? 0.2v - v v ol low level output voltage i ol = 8 ma, v ccio = 2.3v - 0.4 v i ol = 0.1ma, v ccio = 2.3v - 0.2 v 1. the v ih max value represents the jedec specification for lvcmos25. th e coolrunner-ii cpld input buffer can tolerate up to 3.9v without physical damage. symbol parameter (1) test conditions min. max. units v ccio input source voltage 1.7 1.9 v v ih high level input voltage 0.65 x v ccio v ccio + 0.3 (1) v v il low level input voltage ?0.3 0.35 x v ccio v v oh high level output voltage i oh = ?8 ma, v ccio = 1.7v v ccio ? 0.45 - v i oh = ?0.1 ma, v ccio = 1.7v v ccio ? 0.2 - v v ol low level output voltage i ol = 8 ma, v ccio = 1.7v - 0.45 v i ol = 0.1 ma, v ccio = 1.7v - 0.2 v 1. the v ih max value represents the jedec specificat ion for lvcmos18. the coolrunner-ii cpld input buffer can tolerate up to 3.9v without physical damage. symbol parameter test conditions min. max. units v ccio input source voltage 1.4 1.6 v v t+ input hysteresis threshold voltage 0.5 x v ccio 0.8 x v ccio v v t- 0.2 x v ccio 0.5 x v ccio v v oh high level output voltage i oh = ?8 ma, v ccio = 1.4v v ccio ? 0.45 - v i oh = ?0.1 ma, v ccio = 1.4v v ccio ? 0.2 - v v ol low level output voltage i ol = 8 ma, v ccio = 1.4v - 0.4 v i ol = 0.1 ma, v ccio = 1.4v - 0.2 v notes: 1. hysteresis used on 1.5v inputs.
xc2c32a coolrunner-ii cpld DS310 (v2.1) november 6, 2008 www.xilinx.com 5 product specification r schmitt trigger input dc voltage specifications ac electrical characteristics over recommended operating conditions symbol parameter test conditions min. max. units v ccio input source voltage 1.4 3.9 v v t+ input hysteresis threshold voltage 0.5 x v ccio 0.8 x v ccio v v t- 0.2 x v ccio 0.5 x v ccio v symbol parameter -4 -6 units min. max. min. max. t pd1 propagation delay single p-term - 3.8 - 5.5 ns t pd2 propagation delay or array - 4.0 - 6.0 ns t sud direct input register clock setup time 1.7 - 2.2 - ns t su1 setup time fast (single p-term) 1.9 - 2.6 - ns t su2 setup time (or array) 2.1 - 3.1 - ns t hd direct input register hold time 0.0 - 0.0 - ns t h p-term hold time 0.0 - 0.0 - ns t co clock to output - 3.7 - 4.7 ns f toggle (1) internal toggle rate - 500 - 300 mhz f system1 (2) maximum system frequency - 323 - 200 mhz f system2 (2) maximum system frequency - 303 - 182 mhz f ext1 (3) maximum external frequency - 179 - 137 mhz f ext2 (3) maximum external frequency - 172 - 128 mhz t psud direct input register p-term clock setup time 0.4 - 0.9 - ns t psu1 p-term clock setup time (single p-term) 0.6 - 1.3 - ns t psu2 p-term clock setup time (or array) 0.8 - 1.8 - ns t phd direct input register p-term clock hold time 1.5 - 1.6 - ns t ph p-term clock hold 1.3 - 1.2 - ns t pco p-term clock to output - 5.0 - 6.0 ns t oe /t od global oe to output enable/disable - 4.7 - 5.5 ns t poe /t pod p-term oe to output enable/disable - 6.2 - 6.7 ns t moe /t mod macrocell driven oe to output enable/disable - 6.2 - 6.9 ns t pao p-term set/reset to output valid - 5.5 - 6.8 ns t ao global set/reset to output valid - 4.5 - 5.5 ns t suec register clock enable setup time 2.0 - 3.0 - ns t hec register clock enable hold time 0.0 - 0.0 - ns t cw global clock pulse width high or low 1.4 - 2.2 - ns t pcw p-term pulse width high or low 4.0 - 6.0 - ns t aprpw asynchronous preset/reset pulse width (high or low) 4.0 - 6.0 - ns t config (4) configuration time - 50 - 50 s notes: 1. f toggle is the maximum clock frequency to which a t-flip flop can reliably toggle (see the coolrunner-ii family data sheet). 2. f system1 (1/t cycle ) is the internal operating frequency for a device fully populated with one 16-bit counter through one p-term per macrocell while f system2 is through the or array . 3. f ext1 (1/t su1 +t co ) is the maximum external frequency using one p-term while f ext2 is through the or array . 4. typical configuration current during t config is 500 a.
xc2c32a coolrunner-ii cpld 6 www.xilinx.com DS310 (v2.1) november 6, 2008 product specification r internal timing parameters symbol parameter (1) -4 -6 units min. max. min. max. buffer delays t in input buffer delay - 1.3 - 1.7 ns t din direct register input delay - 1.5 - 2.4 ns t gck global clock buffer delay - 1.3 - 2.0 ns t gsr global set/reset buffer delay - 1.6 - 2.0 ns t gts global 3-state buffer delay - 1.1 - 2.1 ns t out output buffer delay - 1.8 - 2.0 ns t en output buffer enable/disable delay - 2.9 - 3.4 ns p-term delays t ct control term delay - 1.3 - 1.6 ns t logi1 single p-term delay adder - 0.4 - 1.1 ns t logi2 multiple p-term delay adder - 0.2 - 0.5 ns macrocell delay t pdi input to output valid - 0.3 - 0.7 ns t ldi setup before clock (transparent latch) - 1.5 - 2.5 ns t sui setup before clock 1.5 - 1.8 - ns t hi hold after clock 0.0 - 0.0 - ns t ecsu enable clock setup time 0.7 - 1.7 - ns t echo enable clock hold time 0.0 - 0.0 - ns t coi clock to output valid - 0.6 - 0.7 ns t aoi set/reset to output valid - 1.1 - 1.5 ns feedback delays t f feedback delay - 0.6 - 1.4 ns t oem macrocell to global oe delay - 0.7 - 0.8 ns i/o standard time adder delays 1.5v cmos t hys15 hysteresis input adder - 3.0 - 4.0 ns t out15 output adder - 0.8 - 1.0 ns t slew15 output slew rate adder - 4.0 - 5.0 ns i/o standard time adder delays 1.8v cmos t hys18 hysteresis input adder - 3.0 - 4.0 ns t out18 output adder - 0.0 - 0.0 ns t slew output slew rate adder - 4.0 - 5.0 ns
xc2c32a coolrunner-ii cpld DS310 (v2.1) november 6, 2008 www.xilinx.com 7 product specification r switching characteristics ac test circuit i/o standard time adder delays 2.5v cmos t in25 standard input adder - 0.5 - 0.6 ns t hys25 hysteresis input adder - 3.0 - 4.0 ns t out25 output adder - 0.6 - 0.7 ns t slew25 output slew rate adder - 4.0 - 5.0 ns i/o standard time adder delays 3.3v cmos/ttl t in33 standard input adder - 0.5 - 0.6 ns t hys33 hysteresis input adder - 3.0 - 4.0 ns t out33 output adder - 1.0 - 1.2 ns t slew33 output slew rate adder - 4.0 - 5.0 ns notes: 1. 1.5 ns input pin signal rise/fall. internal timing parameters (continued) symbol parameter (1) -4 -6 units min. max. min. max. figure 2: derating curve for t pd number of outputs switching 12 4 8 16 3.0 4.0 5.0 v cc = v ccio = 1.8v @ 25 o c t pd2 (ns) 5.5 4.5 3.5 ds091_02_112002 figure 3: ac load circuit r 1 v cc c l r 2 device under test output type lvttl33 lvcmos33 lvcmos25 lvcmos18 lvcmos15 c l includes test fixtures and probe capacitance. 1.5 nsec maximum rise/fall times on inputs. r 1 268 275 188 112.5 150 r 2 235 275 188 112.5 150 c l 35 pf 35 pf 35pf 35pf 35pf DS310_03_102108 test point
xc2c32a coolrunner-ii cpld 8 www.xilinx.com DS310 (v2.1) november 6, 2008 product specification r typical i/o output curves figure 4: typical i/v curve for xc2c32a vo (output volts) xc32_voio_all_0403 io (output current ma) 0 0 40 10 50 20 30 60 3.0 2.5 2.0 1.5 1.0 .5 3.5 3.3v 1.5v 1.8v 2.5v iol pin descriptions function block macrocell qfg32 pc44 (1) vq44 cp56 i/o bank 1 1 44 38 f1 bank 2 1 2 43 37 e3 bank 2 1 3 42 36 e1 bank 2 1(gts1) 4 3 40 34 d1 bank 2 1(gts0) 5 2 39 33 c1 bank 2 1(gts3) 6 1 38 32 a3 bank 2 1(gts2) 7 32 37 31 a2 bank 2 1(gsr)8 313630b1bank 2 1 9 303529a1bank 2 1 10 29 34 28 c4 bank 2 1 11283327c5bank 2 1 12242923c8bank 2 113 2822a10bank 2 1 14232721b10bank 2 1 15 26 20 c10 bank 2 1 16 25 19 e8 bank 2 215139g1bank 1 2 2 2 40 f3 bank 1 2 3 3 41 h1 bank 1 2 4 4 42 g3 bank 1 2(gck0) 5 6 5 43 j1 bank 1 2(gck1) 6 7 6 44 k1 bank 1 2(gck2) 7 8 7 1 k2 bank 1
xc2c32a coolrunner-ii cpld DS310 (v2.1) november 6, 2008 www.xilinx.com 9 product specification r xc2c32a global, jtag, powe r/ground, and no connect pins 2 8 9 8 2 k3 bank 1 2 9 10 9 3 h3 bank 1 2 10 11 5 k5 bank 1 211 126h5bank 1 21213148h8bank 1 2 13171812k8bank 1 2 14181913h10bank 1 2 15192014g10bank 1 2 16 22 16 f10 bank 1 notes: 1. this is an obsolete package type. it remains here for legacy support only. 2. gts = global output enable, gsr = global set reset, gck = global clock. 3. gts, gsr, and gck pins can also be used for general purpose i/o. pin type qfg32 pc44 (1)(2) vq44 (2) cp56 (2) tck 16 17 11 k10 tdi 14 15 9 j10 tdo 25 30 24 a6 tms 15 16 10 k9 input only 22 (bank 2) 24 (bank 2) 18 (bank 2) d10 (bank 2) v ccaux (jtag supply voltage) 4 41 35 d3 power internal (v cc ) power bank 1 i/o (v ccio1 ) power bank 2 i/o (v ccio2 ) 20 21 15 g8 12 13 7 h6 27 32 26 c6 ground 11, 21, 26 10,23,31 4,17,25 h4, f8, c7 no connects - - k4, k6, k7, h7, e10, a7, a9, d8, a5, a8, a4, c3 total user i/o (includes dual function pins) 21 33 33 33 notes: 1. this is an obsolete package type. it remains here for legacy support only. 2. all packages pin compatible wi th larger macrocell densities. pin descriptions (continued) function block macrocell qfg32 pc44 (1) vq44 cp56 i/o bank
xc2c32a coolrunner-ii cpld 10 www.xilinx.com DS310 (v2.1) november 6, 2008 product specification r ordering information device part marking figure 5: sample package with part marking note: due to the small size of chip scale and quad flat no lead packages, the complete ordering part number cannot be included on the package marking. part marking on chip scale and quad flat no lead packages by line are: ? line 1 = x (xilinx logo) th en truncated part number ? line 2 = not related to device part number ? line 3 = not related to device part number ? line 4 = package code, speed, operating temperature, three digits not related to device part number. package codes: c3 = cp56, c4 = cpg56, q1 = qfg32. part number pin/ball spacing ja (c/watt) jc (c/watt) package type package body dimensions i/o comm. (c) ind. (i) (1) xc2c32a-4qfg32c 0.5mm 35.5 24.0 quad fl at no lead; pb-free 5mm x 5mm 21 c xc2c32a-6qfg32c 0.5mm 35.5 24.0 quad fl at no lead; pb-free 5mm x 5mm 21 c xc2c32a-4vq44c 0.8mm 47.7 8.2 very thin quad flat pack 10mm x 10mm 33 c xc2c32a-6vq44c 0.8mm 47.7 8.2 very thin quad flat pack 10mm x 10mm 33 c xc2c32a-4cp56c 0.5mm 66.0 14.9 chip scale package 6mm x 6mm 33 c xc2c32a-6cp56c 0.5mm 66.0 14.9 chip scale package 6mm x 6mm 33 c xc2c32a-4vqg44c 0.8mm 47.7 8.2 very thin quad flat pack; pb-free 10mm x 10mm 33 c xc2c32a-6vqg44c 0.8mm 47.7 8.2 very thin quad flat pack; pb-free 10mm x 10mm 33 c xc2c32a-4cpg56c 0.5mm 66.0 14.9 chip sc ale package; pb-free 6mm x 6mm 33 c xc2c32a-6cpg56c 0.5mm 66.0 14.9 chip sc ale package; pb-free 6mm x 6mm 33 c xc2c32a-6qfg32i 0.5mm 35.5 24.0 quad fl at no lead; pb-free 5mm x 5mm 21 i xc2c32a-6vq44i 0.8mm 47.7 8.2 very thin quad flat pack 10mm x 10mm 33 i xc2c32a-6cp56i 0.5mm 66.0 14.9 chip scale package 6mm x 6mm 33 i xc2c32a-6vqg44i 0.8mm 47.7 8.2 very thin quad flat pack; pb-free 10mm x 10mm 33 i xc2c32a-6cpg56i 0.5mm 66.0 14.9 chip sc ale package; pb-free 6mm x 6mm 33 i notes: 1. c = commercial (ta = 0c to +70c); i = industrial (ta = ?40c to +85c) standard example: xc2c128 device speed grade package type number of pins temperature range -4 tq c 144 pb- free example: xc2c128 tq g 144 c device speed grade package type pb -free number of pins -4 temperature range xc2cxxx tq144 7c de v ice type package speed operating range this line not related to de v ice part n u m b er r part marking for non-chip scale package DS310_05_10210 8
xc2c32a coolrunner-ii cpld DS310 (v2.1) november 6, 2008 www.xilinx.com 11 product specification r figure 6: qfg32 package figure 7: vq44 package figure 8: pc44 package qfg32 top view i/o i/o input gnd vcc i/o i/o i/o i/o(1) i/o(3) i/o i/o i/o vccio2 gnd tdo i/o i/o gnd vccio1 i/o tdi tms tck i/o(1) i/o(1) i/o(1) v aux i/o i/o(2) i/o(2) i/o(2) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 24 23 22 21 20 19 18 17 32 31 30 29 28 27 26 25 (1) - global output enable (2) - global clock (3) - global set/reset vq44 top view i/o (1) i/o (1) i/o (1) i/o (3) i/o i/o i/o v ccio2 gnd tdo i/o i/o (2) i/o (2) i/o i/o i/o i/o i/o i/o i/o v aux i/o (1) i/o i/o i/o v cc i/o gnd i i/o i/o i/o i/o i/o (2) i/o i/o gnd i/o i/o v ccio1 i/o tdi tms tck 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 33 32 31 30 29 28 27 26 25 24 23 44 43 42 41 40 39 38 37 36 35 34 (1) - global output enabl e (2) - global clock (3) - global set/reset pc44 top view i/o (1) i/o (1) i/o (1) i/o (3) i/o i/o i/o v ccio2 gnd tdo i/o i/o (2) i/o (2) i/o i/o i/o i/o i/o i/o i/o v aux i/o (1) i/o i/o i/o v cc i/o gnd i i/o i/o i/o i/o i/o (2) i/o i/o gnd i/o i/o v ccio1 i/o tdi tms tck 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 39 38 37 36 35 34 33 32 31 30 29 6 5 4 3 2 1 44 43 42 41 40 (1) - global output enable (2) - global clock (3) - global set/reset
xc2c32a coolrunner-ii cpld 12 www.xilinx.com DS310 (v2.1) november 6, 2008 product specification r warranty disclaimer these products are subject to the terms of the xilinx limited warranty which can be viewed at http://www.xilinx.com/warranty.htm . this limited warranty does not extend to any use of the products in an application or environment that is not within the specifications stated on the then-current xilinx data sheet for the products. products are not designed to be fail-safe and are not warranted for use in applications that pose a risk of physical harm or loss of life. use of products in such applications is fully at the risk of customer subject to applicable laws and regulations. figure 9: cp56 package cp56 bottom view i/o (2) i/o (2) i/o nc i/o nc nc i/o tms tck i/o (2) tdi i/o i/o gnd i/o v cc io1 nc i/o i/o i/o i/o v cc i/o i/o i/o gnd i/o i/o i/o i/o nc i/o (1) v aux nc i i/o (1) nc i/o i/o v cc io2 gnd i/o i/o i/o (3) i/o i/o i/o (1) i/o (1) nc nc tdo nc nc nc i/o k j h g f e d c b a 1 2 3 4 5 6 7 8 9 10 (1) - global output enable (2) - global clock (3) - global set/reset
xc2c32a coolrunner-ii cpld DS310 (v2.1) november 6, 2008 www.xilinx.com 13 product specification r additional information additional information is available fo r the following coolrunner-ii topics: ? xapp784: bulletproof cpld design practices ? xapp375: timing model ? xapp376: logic engine ? xapp378: advanced features ? xapp382: i/o characteristics ? xapp389: powering coolrunner-ii ? xapp399: assigning vref pins to access these and all application notes with their associ- ated reference designs, click the following links and scroll down the page until you find the document you want: coolrunner-ii cpld data sheets and application notes device packages revision history the following table shows the revision history for this document. date version revision 6/15/04 1.0 initial xilinx release. 8/30/04 1.1 pb-free documentation 10/01/04 1.2 add asynchronous preset/reset pulse widt h specification to ac electrical characteristics. 11/08/04 1.3 product release. no changes to documentation. 11/22/04 1.4 changes to output enable/disable specifications; changes to i ccsb . 02/17/05 1.5 changes to f toggle , t slew25 , and t slew33 03/07/05 1.6 improvement of pin-to-pin logic delay, page 1. modifications to table 1, iostandards. 06/28/05 1.7 move to product specification. change to t in25 , t out25 , t in33 , and t out33 . 03/20/06 1.8 add warranty disclaimer. add note to pin descriptions that gck, gsr, and gts pins can also be used for general purpose i/o. 02/15/07 1.9 change to v ih specification for 2.5v and 1.8v lvcmos. change to t oem for -4 speed grade. 03/08/07 2.0 fixed typo in note for v il for lvcmos18; removed note for v il for lvcmos33. 11/06/08 2.1 added note to pin description tables to indicate the pc44 packages are obsolete. removed part numbers for devices in pc44 packages from ordering information. see product discontinuation notice xcn07022.pdf .
xc2c32a coolrunner-ii cpld 14 www.xilinx.com DS310 (v2.1) november 6, 2008 product specification r


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